01DESIGN
We design it directly.
We design cell structures, process recipes, packages and thermal paths with our own technology.
- Cell Structure
- Process Recipe
- Package
- Thermal Path
About Us
Business Model
A Virtual IDM model connecting design, manufacturing, verification and supply
01FULL-STACK MODEL
We design it. We control it.We own it to the end.
From device design to customer-system deployment, DICIO defines the standards at every stage.
DICIO directly designs the cell structure, process recipe, package and thermal path; controls process data, qualification and change management under one standard; and remains accountable for product performance and quality through customer-system deployment.
02CONTROL
We control it directly.
Process data, qualification and change control are governed under one standard.
- Lot Process Data
- Qualification Protocol
- PCN / PDN
- Change Management
03RESPONSIBILITY
We take responsibility.
Whatever the supply format, we remain accountable for performance and quality in the customer system.
- Wafer / Bare Die
- Discrete
- Power Module
- Customer System Performance
DICıOFULL-STACK
MODEL
MODEL
- 01Device DesignDevice design
- 02Wafer ProcessWafer process
- 03Package & ModulePackage · module
- 04QualificationEvaluation · qualification
- 05Design-in & SupplySystem deployment · mass production
At every stage, DICIO sets the standard,and for the outcome, DICIO takes responsibility.
02 WHAT MAKES DICIO DIFFERENT
Not a predetermined product.Designed around your system.
DICIO directly designs and controls every stage, from device architecture through customer-system deployment. Instead of offering the same predetermined product, we engineer each solution to perform at its best under the customer's actual operating conditions.
Standard product
A pre-defined product selected and supplied.
DICIO Full-Stack
Every stage is designed around the customer system.
01
Device Design
One standard cell for every application
The same general-purpose cell characteristics are used across applications.
Application-specific cell design
Device characteristics are optimised for the application and switching position.
02
Process Recipe
Standard process as-is
The standard process is used without application-specific optimisation.
Proprietary process recipe
A proprietary process recipe is developed for the optimised device design.
03
Package · Module Design
General package, fixed configuration
A standard package and predetermined configuration are used.
Optimised package and module design
Low-inductance, thermal-path optimisation and drop-in design for the customer system.
04
Qualification
General data under standard conditions
General data measured under standard conditions are provided.
Reliability qualification
Verified by independent laboratories to AQG 324, JEDEC and IEC 60749 criteria.
05
Design-in · System Validation
Datasheet-centred support
Support is centred on the datasheet.
1:1 validation in the customer system
Performance is compared 1:1 in the actual customer system to determine the optimum conditions.
06
Supply · Responsibility
Catalogue items and datasheet criteria
Products are supplied according to catalogue items and datasheet criteria.
Unified supply and accountability
Wafer, discrete and module supply is unified, with DICIO accountable for performance and quality.
Integrated power semiconductor platform
Devices through modules connected by a single design philosophy
Dicio's Virtual IDM does not stop at connecting manufacturing partners. Device electrical characteristics, package structure, module topology and the operating conditions of the customer system are integrated into one design process.
| Platform element | Scope |
|---|---|
| Semiconductor technology | Si IGBT, SiC MOSFET, SiC SBD |
| Voltage platform | 600 V – 4,500 V |
| Supply format | Wafer / bare die, discrete, module |
| Module technology | IGBT, hybrid IGBT, full SiC |
| Packaging technology | Low-inductance structure, insulating substrate, thermal design |
| Application support | Product selection, sample evaluation, custom design, co-development |
The voltage range describes the overall technology platform. Individual products on this site are marked with their supply status as follows.
- Mass Production
- Sampling
- Development
- Roadmap
Application-oriented co-design
We start from the customer system, not from a product specification
Dicio's differentiator is described as Application-Oriented Power Module Design.
Rather than supplying a predetermined module, Dicio analyses the operating conditions of the customer system and tunes semiconductor characteristics and module structure together.
System requirement analysis
- System topology
- DC link voltage
- Output and load conditions
- Switching frequency
- Cooling method
- Reliability and lifetime targets
Device characteristics optimisation
- Low switching loss IGBT
- Low conduction loss IGBT
- SiC SBD and FRD combinations
- Characteristics per switching position
- Balance of conduction and switching loss
Module structure optimisation
- 2-level and 3-level NPC topologies
- Hybrid and full SiC configurations
- Low parasitic inductance
- Thermal conduction and cooling structure
- Balanced current and temperature distribution
Value for customers
A product that fits the system
Not merely a device that matches voltage and current, but a solution that accounts for topology, switching frequency and cooling conditions.
Flexible supply formats
Depending on development stage and internal capability, supply can be wafer / bare die, discrete or module.
Development efficiency
Device selection, packaging and module design are discussed through a single technical channel, reducing development complexity.
System performance optimisation
Not a single figure such as low VCE(sat) or RDS(on), but conduction loss, switching loss and thermal performance considered together.
Supply chain flexibility
Specialist manufacturing partners matched to each product reduce dependence on a specific production facility and keep supply options open.
Long-term co-development
From initial product selection to sample evaluation, custom design and mass production transfer, we support the customer's development process throughout.