Dicio Inc.
Products

DISCRETE & WAFER

A power semiconductor platform supplied in forms ranging from standard packages to bare die and wafer.

Selection GuidePower ModulesDiscrete & WaferCustom Solutions

Discrete & Wafer

Power semiconductor platforms supplied in the form your design requires

DICIO supplies the SiC MOSFET, SiC SBD and Trench-Gate IGBT technologies used in its modules as discrete devices and bare die or wafer products.

TO-247 supports established through-hole designs, JEDEC MO-354 (QDPAK) serves high-density SMD power stages, and wafer, sawn die and KGD formats support customers developing their own modules and packages.

Same Die as Our Modules

The same DICIO device technology used in our modules

Industry-Standard Packages

TO-247 · JEDEC MO-354

Device-Level Supply

Wafer · Sawn Die · KGD

PRODUCT LINE-UP

Discrete & Wafer
Line-up

Select a product to view its specifications and applications.

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TO-247 Discrete

SiC MOSFET, SiC Schottky Diode and IGBT in the industry-standard TO-247 package

Voltage

600 / 1200 / 1700 V*

Technology

SiC MOSFET · SiC SBD · IGBT

Package

TO-247-3 / TO-247-4

DICIO TO-247 Discrete products apply proprietary SiC MOSFET, SiC SBD and Trench-Gate IGBT dies to the most widely adopted through-hole power package.

The four-lead Kelvin Source version separates the gate-return path from the power-source path for precise gate control under high di/dt conditions. Its standard footprint supports existing inverter, PSU and charger boards.

Downloads & Resources

Resources for TO-247 Discrete

Sample Request

* In development

DEVICE SUPPLY SUPPORT

DICIO power semiconductors, supplied in the form you need

From standard discrete packages to bare die and wafer, we propose products and delivery formats suited to your system architecture and packaging environment.

Selection GuideTechnical Inquiry